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USA WAFER FOUNDRY SERVICES |
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USA WAFER FOUNDRY TECHNOLOGY Standard semiconductor devices supplied by many manufacturers in USA WAFER FOUNDRY are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. For extreme applications the USA WAFER FOUNDRY has to withstand even harsher environmental conditions without the protection of a package. USA WAFER FOUNDRY technology has reengineered industry standard TECHNOLOGIES and now offers known good die for USA WAFER FOUNDRY applications with gold interconnection and well-engineered materials that further enhance the die reliability. USA WAFER FOUNDRY SERVICES are used in assembly of COB (Chip on Board) and SiP (System-in-Package) which are proven mature technologies that integrate USA WAFER FOUNDRY of mixed technologies i.e. Si, SiC, GaAs, GaN, InP, and passive components that otherwise cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. USA WAFER FOUNDRY integrated circuits are manufactured with medium voltage junction isolated bipolar process. junction isolated bipolar processes allow integration of high performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors and precision thin film resistors.The bond pad metallization is standard 3μm Gold but certain IC have 1μm Aluminum for certain IC . The backside of the die is coated with 0.5μm Gold , which makes it compatible with AuSi, AuGe or conductive silver epoxy die attach. USA WAFER FOUNDRY SERVICES are integrating resistors, capacitors, Schottky diodes, Zener diodes and transistors. USA WAFER FOUNDRY passive and active networks are manufactured using in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these TECHNOLOGIES are ideal for hybrid and multi chip module applications. In packaged form, these TECHNOLOGIES are the best solution where space and weight are a concern. All thin film only TECHNOLOGIES are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. USA WAFER FOUNDRY resistive TECHNOLOGIES TECHNOLOGIES are manufactured with proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq (one ohm per square) to 1MΩ/sq (one mega ohm ohm per square). USA WAFER FOUNDRY manufactures also high stability, high temperature and very high density 3D capacitors which have capacitance density potentially greater than 100nF/mm2 at 16V. All USA WAFER FOUNDRY SERVICES are available in die form and are ideal for high reliability hybrid and multi chip module applications. USA WAFER FOUNDRY SERVICES also offers Silicon Printed Circuit Board and Silicon Interposer technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. |
| USA WAFER FOUNDRY SERVICES | Tel:408-634-2108 Fax: 408-986-8027 | USA WAFER FOUNDRY SERVICES | ||
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A die is a small block of semiconductor material, ceramic or glass on which a given circuit function is fabricated. Many dice are manufactured in large batches at the same time on a substrate or wafer in a series of successive photolithographic processes. Upon completion of the manufacturing process, the substrates or wafers are diced in many die. Substrate or wafer singulation also referred as dicing or sawing process is final critical step in USA WAFER FOUNDRY manufacturing process. Our company has undertaken the task to redesign and manufacture the future semiconductor and thin film USA WAFER FOUNDRY components. Our USA WAFER FOUNDRY SERVICES are used in assembly of hybrid circuits and are compatible with chip and wire, flip chip, chip scale CSP and surface mount technologies SMD. In today's extreme miniaturization market, there is no more room for the large packages to protect the die. It means that the USA WAFER FOUNDRY has to survive on its own without the protection of a package. Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. The solution developed by our company for known good die for USA WAFER FOUNDRY applications is gold interconnection and gold terminations and well-engineered materials that further enhance the die reliability. Our company designs and manufactures standard and custom semiconductor and thin film components for bio-medical, wireless telecommunications, optoelectronics, computing, industrial, military and space and satellite applications. USA WAFER FOUNDRY SERVICES is a product line of US Microwaves, usmicrowaves.com, . USA WAFER FOUNDRY SERVICES is manufacturer of high reliability microwave integrated circuits MIC technology. USA WAFER FOUNDRY SERVICES offers a multitude of applied thin film TECHNOLOGIES and microwave semiconductor devices: manufactures and supplies high quality standard microwave thin film circuits and microwave devices using advanced technical ceramics and semiconductor materials; USA WAFER FOUNDRY SERVICES include RF micro devices for hybrid chip and wire applications; microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky diodes, PIN diodes, tunnel diodes, SRD diodes, varactor diodes and zero bias diodes, RF NPN and PNP bipolar transistors, high speed LDMOS , VDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe. USA WAFER FOUNDRY SERVICES is a product line of SmxSemi, smxsemi.com . USA WAFER FOUNDRY SERVICES, Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. As an analog devices and ASIC analog design and manufacturing house, USA WAFER FOUNDRY SERVICES produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFET s, MCT (MOS controlled tyristors), IGBT. USA WAFER FOUNDRY SERVICES is a product line of Semiconwell, semiconwell.com . USA WAFER FOUNDRY SERVICES designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, industrial controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors, diodes and schottky diodes and are available in through hole and surface mounted packages. SEMICONWELL is supplying integrated termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes networks and are inventoried by the designated part numbers and can be ordered on line, from factory or from distributors. Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. USA WAFER FOUNDRY SERVICES USA WAFER FOUNDRYrication is handled by HTE Labs that provides USA WAFER FOUNDRY, R&D support and Specialty USA WAFER FOUNDRY Processing to customers from semiconductors and microelectronics industry. USA WAFER FOUNDRY includes the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty USA WAFER FOUNDRY processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. |